Your Professional Thin Film Pressure Sensor Soldered Module Supplier
Xian Baochen Information Technology Co., Ltd. is located in high-tech Zone, Xi 'an, Shaanxi Province, China, is a focus on sensors, transmitters, inverters, power semiconductor devices and supporting instruments R & D, manufacturing, sales and service enterprises. The company invests in research and development team, cooperates with excellent universities, integrates industry resources, and provides the best quality solutions for domestic and foreign users. Enterprise mission: to meet user needs and create value for customers.
Why choose us
Sales Market
We Products are exported to Europe, America, Southeast Asia, West Asia, Central Asia and other countries around the world. Our products are well received in these markets.
Our Service
Able to quickly respond to customer needs, to provide personalized customization, timely delivery, professional technical support and perfect after-sales service.
Strict Quality Control System
Able to efficiently produce large quantities of products, advanced production processes and stable supply chains, the implementation of strict quality control system. Constantly introduce new technologies and new materials to improve product performance and production efficiency.
Wide Range of Applications
Through the EU CE, RoHs testing, products are widely used in petrochemical, water conservancy and hydrology, machinery and equipment, automobile manufacturing, industrial process control, weighing measurement, people's livelihood applications and other fields.
Thin Film Pressure Sensor Soldered Module
The thin-film pressure sensor welding module is a key component to ensure reliable electrical connection between the sensor and the circuit system. Its core lies in connecting the sensitive area of the sensor to the flexible printed circuit board (FPC) or other circuits through a high-precision welding process, while ensuring stable signal transmission under the action of pressure.
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Technical specification |
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Thickness: |
The 0.4 mm |
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Sample type: |
Sheet, flexible |
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Contact force: |
The value is less than 20g and the default resistance is less than 200 kω |
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Pressure sensing range: |
20g~10kg |
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Pressure mode of action: |
Static or dynamic (frequency up to 10Hz) |
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Resistance when not triggered: |
Greater than 10MΩ |
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Active time: |
Less than 0.01S |
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Operating temperature: |
- 40 ℃ ~ + 85 ℃ |
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Durability: |
More than a million times |
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Homogeneity: |
Resistance value of a single product within +/-15%, the same batch of products within +/-30% (under the same test conditions) |
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Delay: |
+15%,(RF+-RF-)/FR+,3000g force |
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Response time: |
<10ms |
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Electromagnetic interference EMI: |
Don't produce |
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Electrostatic discharge EDS: |
Insensitive |
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Drift: |
-15%,3Kg force static load 24H |
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RoHS compliant: |
RoHS compliant |
Features of Thin Film Pressure Sensor Soldered Module
Non-contact laser welding
Uses a high-energy-density laser beam (wavelength 1070nm, power 60-200W) to precisely melt solder balls, eliminating deformation or creases in the FPC caused by mechanical clamping.
Micron-level thermal management
Annular spot temperature control technology uses multi-focus laser scanning to achieve thermal gradient distribution, keeping the substrate temperature rise ≤30°C and the sensitive layer temperature rise ≤5°C.
High-precision process system
The vision positioning system equipped with a 5-megapixel CCD camera achieves ±0.03mm positioning accuracy and supports automatic alignment of 0.1mm solder pads.
Full-process reliability assurance
The solder joint strengthening process using SnAgCu alloy solder balls increases shear strength by 40%, passing 3,000 thermal cycle tests (-40°C to 125°C).
Non-contact laser welding module
Uses a high-energy-density laser beam (such as a 1070nm wavelength semiconductor or fiber laser) to precisely melt solder balls. An inert gas (nitrogen/argon, purity ≥99.99%) protects the soldering area to prevent oxidation.
Reflow soldering module
Uses a preset temperature profile (such as preheating, soaking, reflow, and cooling) to batch solder the entire circuit board, connecting components to the PCB by melting solder paste.
Hot air gun soldering module
Uses a hot air gun to generate high-temperature airflow to melt solder, achieving localized soldering. Suitable for small batches or repairs. Simple equipment and easy operation.
Manual soldering module (assisted type)
Manually melts solder with a soldering iron to complete the soldering process. No complex equipment is required, making it suitable for simple circuits or repairs.
Applications of Thin Film Pressure Sensor Soldered Module
Medical Devices
In the soldering of micro FPCs and PCBs, pulsed laser mode (single pulse energy ≤ 2J) avoids damage to biocompatible coatings.
Industrial Automation
For the soldering of 5G optical modules, dynamic path planning by a multi-axis robotic arm enables 360° circular solder joints with a speed of ≤ 0.3 seconds per point and a roundness error of ≤ 0.05mm.
Consumer Electronics
In the soldering of micro load cells, low-temperature SnBi solder (melting point 138°C) combined with gradient heating technology reduces the backside temperature rise of a 3x2.5mm epoxy novolac substrate to ≤ 25°C.
Technical Principle of Thin Film Pressure Sensor Soldered Module
The core principle of thin-film pressure sensor welding modules is to convert changes in sensor resistance (the resistance decreases with increasing pressure) into a measurable electrical signal. The welding process must ensure electrical connection between the sensor's sensitive layer and the circuit while avoiding thermal or mechanical damage to sensitive materials (such as the piezoresistive layer deposited by CVD/PVD). Typical welding methods include:
Non-contact laser welding: This method uses a high-energy-density laser beam to precisely melt solder balls, avoiding deformation of the FPC caused by mechanical clamping. It is suitable for soldering miniaturized sensors (e.g., with pad sizes ≤0.2mm).
Reflow soldering: This method uses a preset temperature profile to batch-solder sensors to PCBs, but requires strict control of the heat-affected zone (HAZ) to prevent carbonization of the substrate or desorption of the sensitive layer.
Manual soldering: This method is only suitable for emergency repairs or small-batch trial production, and can lead to inconsistent soldering quality due to varying operator skills.
Note
The sensor module uses a sensor element in series with a 510Kohm resistor.
One end of the sensor is connected to a 5V power supply, one end is connected to a 510Kohm resistor,and the other end is connected to GND. When testing,one end of the sensor connected to the resistance is the signal end,which is connected to the analog port.
According to the above description,we get the calculation formula of resistance and analog value:R=(1023-A0)*510/A0,unit is Kohm; According to the above formula,we get the resistance value of the sensor element,and we can roughly get the pressure value.
When the pressure value is greater than 5000g,the pressure value changes,and the resistance value hardly changes.Therefore,we recommend that the maximum pressure value is 5000g when testing.
Since the sensing area of the sensor element is recessed, when testing, the test object needs to be placed in the sensing area in the middle of the wafer to test the results.If the sensor is directly placed on a flat surface,the test object is placed on the sensor to sense District,there is no test result.Therefore,we need to pad a small object in the sensor sensing area,and then put the test object on the small object in the sensor sensing area to test the results.
FAQ
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thin film pressure sensor soldered module